BG Tape|back grinding tape,Dicing tape, detaping

Base Flim

Color

Total Thickness

Adhesive Thickness(um)

EVA, PET

Light Blue Transparent

140um, 160um,85um

20um~2um

※Feature:

- Provides strong adhesion to prevent chip scattering and slurry penetration during grinding

- Reduces the risk of backside chipping during wafer grinding.

- Minimizes kerf shift to maintain chip alignment and precision.

- Prevents wafer warpage after grinding for improved flatness and yield.

※Nexteck BG Tape: NDT-ATS122, NDT-ATS124, NDT-P Series

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