SEMICON Taiwan 2019 is an annual event of Taiwan's semiconductor industry. It is held from September 18 to 20 and attracts a stream of visitors all over the world. During the exhibition, NEXTECK received a large number of customers at booth I-2011 exhibition.

The new electronic packaging materials DENKA Cover Tape and  full range of cutting tapes (DENKA ELEGRAP TAPE) are displayed and attracted lots of industrial experts. NEXTECK team members introduce the new products elaborately and patiently. Our compact and flexible pavilion make the visit more comfortable and interesting.

The Cover Tape and ELEGRAP TAPE on the NEXTECK booth are extremely high-tech. They are utilized as carrier tapes for LED, SMT, SMD and IC parts as well as upper cover tape, heat seal cover tape and package cover tape. Customers on the site expresses their strong cooperation intentions with NEXTECK for Cover Tape and ELEGRAP TAPE, and leave precious business cards for further negotiation.