Welcome To NEXTECK
Welcome To NEXTECK
Nexteck offers a comprehensive range of UV dicing tapes, engineered to deliver high yield, process stability, and excellent die handling. Ideal for wafer dicing, die pick-up, high-temperature processes, and ESD-sensitive environments.
• Suppresses backside chipping and die fly-out for better yield
• Strong adhesion and flexibility, works well on tough surfaces like EMC
• Stable over time for long-term storage and multi-step processing
• High elongation for easy die pick-up and handling
• High-temperature UV type available, withstanding up to 200°C
• Antistatic options for ESD-sensitive applications
• Available in clear, milky white, and light blue for easy identification
• Silicon(Si) gallium arsenide (GaAS) and other types of semiconductors
• Package substrate (BGA/QFN etc)
• Glass, Crystal
• For middle-bumped wafers & detaping back grrinding tape
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Nexteck's product and market focus is on Electronics, Semiconductors, Passive Components, Displays, Solar PV/Wind Power, AeroSpace and Military industrial.
